Ultrafuse PA is suitable for a wide range of applications working within a larger temperature range than normal PA filament. BASF‘s Ultramid® grades are molding compounds on the basis of PA6, PA66 and various co-polyamides such as PA6/66.
Ultramid® is noted for its high mechanical strength, stiffness and thermal stability.
In addition, Ultramid® offers good toughness at low temperatures. Owing to its excellent properties, this material has become indispensable in almost all sectors of engineering for a wide range of different components and machine elements, as a high-grade electrical insulation material and for many special applications.
Ultrafuse PA is the translation of BASF´s Ultramid® to 3D printing space.
With Ultrafuse PA, it is possible to print semi-flexible thin parts, however it is very stiff in higher thicknesses. It has a lower melting temperature than PA6 and PA66 hence it can be printed in a lower temperature as well as it has better impact strength against PA6 and PA66 which opens up a new application field to the end-users. Depending on specific requirements, the formulation can be optimized further, and special filaments can be created.
Advantages of Ultrafuse PA
- Good fatigue resistance
- Low melting point makes it printable for many FFF printers
- Good wear resistance/lubricity
Reference Links and Documents
Technical Data Sheet - Download
Safety Data Sheet - Download